CMP PRO-6
The Rtec-Instruments CMP Pro-6 Chemical Mechanical Polisher is a high-performance benchtop CMP system designed for research, process development, and polishing consumable evaluation. Combining precise downforce control, programmable platen and carrier speeds, automatic slurry delivery, and in-situ or ex-situ conditioning, the CMP Pro-6 enables engineers to optimize polishing recipes with exceptional repeatability. Its rigid platform accommodates wafers up to 6 inches while supporting the development of advanced semiconductor, MEMS, optics, and materials polishing processes. Whether improving removal rate, within-wafer uniformity, pad conditioning, or slurry performance, the CMP Pro-6 provides the flexibility and control required to accelerate CMP innovation and improve manufacturing yield.
Key Features
- Precise Process Control
- Fully Programmable Slurry Delivery
- Versatile Wafer Handling
- Advanced Pad Conditioning
- Designed for CMP Research & Development
Manufacturer
Rtec Instruments
Rtec Instruments develops and manufactures advanced mechanical and surface testing and measurement solutions for research and industrial applications. They specialise in combining techniques that provide a unique perspective in material testing. Their testers include tribometer, profilometer, scratch tester, high-temperature indenter, and corrosion testers. Furthermore, their testers provide the most robust and versatile platform in the market for testing friction, wear, adhesion, hardness, roughness, and film thickness from nano to macro-scale.
Precise Process Control
Precisely control every polishing parameter with programmable platen speed, carrier speed, and adjustable downforce. The Rtec-Instruments CMP Pro-6 delivers exceptional repeatability for optimizing removal rate, surface finish, and within-wafer uniformity. Reproduce polishing conditions with confidence while accelerating process development and reducing experimental variability.
Fully Programmable Slurry Delivery
Integrated programmable slurry and DI water delivery ensure consistent fluid distribution throughout every polishing cycle. Evaluate new slurry chemistries, optimize polishing recipes, and improve process stability while reducing slurry consumption. Automated delivery enhances repeatability and minimizes operator influence for reliable CMP process development.
Versatile Wafer Handling
Support multiple wafer sizes using interchangeable carrier heads for 2", 4", and 6" substrates. The versatile platform enables polishing of semiconductor wafers, MEMS devices, optical materials, and advanced ceramics on a single system, providing maximum flexibility for research laboratories and process development.
Advanced Pad Conditioning
Integrated in-situ and ex-situ pad conditioning maintains consistent pad surface properties throughout polishing. Optimize conditioning parameters, extend pad lifetime, and improve polishing uniformity while evaluating pad performance under realistic operating conditions. Achieve stable, repeatable CMP results across every stage of process development.
Designed for CMP Research & Development
Purpose-built for CMP research, the Rtec-Instruments CMP Pro-6 provides the flexibility required to develop and optimize polishing processes, consumables, and materials. Investigate polishing pads, slurries, conditioners, and wafer materials while accelerating process innovation before transferring optimized recipes to production environments.
Typical CMP Applications
Semiconductor Manufacturing
- Silicon wafer polishing
- Oxide (SiO₂) planarization
- Copper CMP
- Dielectric CMP
- Advanced logic and memory devices
MEMS Manufacturing
- Surface planarization
- Microfabrication process development
- MEMS wafer finishing
CMP Process Development
- Removal rate optimization
- Within-wafer non-uniformity studies
- Recipe development
- Process repeatability evaluation
CMP Consumable Evaluation
- Polishing pad performance
- Slurry development
- Conditioner optimization
- Backing film evaluation
Materials Research
- Advanced ceramics
- Glass polishing
- Sapphire substrates
- Compound semiconductors (SiC, GaN)
- Optical materials
University & Research Laboratories
- CMP process education
- New polishing chemistries
- Surface finishing research
- Materials characterization
Technical Information
| Platen Diameter | 380 mm |
| Platen Speed | 1-100 rpm |
| Wafer Size | up to 6” Wafer |
| Max Downforce | 25kgf |
| Head rpm | 1 - 100 rpm |
| Conditioner | 4.25” diameter |
| Additional Options | Carrier head for 6’’’,4’’’,2” wafers |
| Power | 220V, 30A |
| Size | 870 x 800 x 870mm |
Service Support
Comprehensive repairs and servicing
Annual Support Programs
Your metrology instrumentation is a major investment that is critical to your business operation and success. In today’s competitive climate, it is more important than ever to extend the functionality and peak performance of your metrology equipment years beyond the expiration of your factory warranty. CN Tech’s Support Programs will help ensure that your investment is protected, and that you and your instrument’s are always operating at peak performance.
With over 20 years’ experience servicing and repairing you can be assured that your system is in safe hands. The independent services we offer include system relocation, maintenance visits, parts and consumables, and break down interventions.
CN Tech’s Support Programs are an economical way to guarantee optimal working condition:
- Annual Preventive Maintenance
- Priority Technical Assistance
- Preferred Parts Availability
- On-Site User Training
- Remote Diagnostics
- No surprise repair expense and much more!
Support Contact Example
An example of our service and support contracts are shown below:
Metrology & Instrumentation Annual Support Programs 2024/25
CN Tech's Support Programs will help ensure that your investment is protected, and that you and your instrument’s are always operating at peak performance.