Tencor™ P-170 Stylus Profiler
The leading-edge surface profilometry technology of the KLA P-17, combined with a production-proven wafer handling system makes the P-170 a high performance solution for 24x7 production environments. Supports a wide range of automated measurements from a few nanometers to one millimeter. The system supports 2D and 3D measurements of step heights, roughness, bow, and stress for scans up to 200mm without stitching with advanced pattern recognition algorithms, enhanced optics, and an advanced stage for robust performance and seamless recipe transportability between systems.
A global technology leader who make an impact by creating solutions that drive progress and transform industries. Collaboration is the key to their success. KLA provide leading-edge technology and devices using advanced inspection tools, metrology systems, and computational analytics. Their solutions accelerate tomorrow’s electronic devices. The enable evolution and innovation in the data era across key industries including automotive, mobile and data center.
- Step Height Repeatability of 4Å on a 1µm step
- Long Scan Over Full 200mm Stage without stitching
- Video: 5MP high-resolution color camera
- Low force with constant force control: 0.03 to 50mg
- 2D & 3D Measurements Including Stress
- Auto Pattern Recognition & Sequencing
- Automatic Wafer Cassette Handling System
- Seamless Automation Recipe Transportability
- Software: Easy-to-use software interface
- Production capability: Fully automated with sequencing, pattern recognition and SECS/GEM
- Wafer handler: Automatically loads 75mm through 200mm opaque
Automatic Sample Handling & Inspection
The KLA P-170 Stylus Profiler combines the marketing leading measurement technology of the P-17 with the production proven HRP®-260 automated sample handling system. This combination makes the P-170 a powerful and flexible solution for inspection applications in the semiconductor, compound semiconductor, and other related industries. The sample handling system supports up to two cassette stations, and samples between 75mm and 200mm in diameter, with fully automatic handling.
A comprehensive set of automation features are available with the P-170, including defect review, sequencing, pattern recognition, and integration with SECS/GEM and HSMS. KLA’s Pattern recognition algorithms provide automatic sample alignment, enhancing measurement stability and reducing operator error. Automation recipes are fully transportable between systems.
High Measurement Repeatability
With over 40 years of experience developing surface metrology technology, the UltraLite® sensor used in KLA’s P-170 is highly advanced, with excellent measurement speed and accuracy. The UltraLite® sensor features constant force control, which improves measurement stability, and enables the accurate measurement of soft materials such as photoresist. The UltraLite® technology also provides market leading measurement repeatability, with a step height repeatability of 4Å on a 1μm step.
A high vertical resolution and range, from nanometres to 1000μm, allows the UltraLite® sensor to provide unprecedented detail and clarity in surface measurements. The wide Z range allows for greater flexibility when measuring samples with large variations in topography.
Unmatched Scan Length Of 200mm
The P-170’s automatic stage is able to perform long scans across the full 200mm diameter of the stage, in a single continuous scan without the need for scan stitching. The full diameter of sample wafers can be measured in a single scan. With a 200mm long scan length the P-170 is a market leader, and provides unmatched accuracy and efficiency.
Comprehensive 2D & 3D Measurement Capabilities
The P-170 offers a fully featured range of 2D and 3D measurements suitable for production environments. Step height can be measured with a vertical range from nanometres to 1000µm. Detailed 3D topographies can be produced for surface visualisation and defect review. The UltraLite® sensor’s constant force control allows for accurate measurement of soft materials.
2D and 3D measurements of texture, including roughness and waviness, and 2D surface bow and shape measurements are also supported. The P-170 can also be configured for measuring 2D and 3D stress for samples with multiple layers. With the P-170’s motorised 200mm stage, 2D stress measurement can be measured in a single scan across the diameter of a sample without stitching. 3D stress uses a series of 2D scans, rotating the stage between scans.
Shown left: 3D Surface Topography
Shown right: 3D Stress Mapping
Tencor™ P-17 & P-17 OF
- Step Height: 2D step height
- Texture: 2D roughness and waviness
- Form: 2D bow and shape
- Stress: 2D thin film stress
- Defect review: 2D and 3D defect surface topography
- Universities, research labs and institutes
- Semiconductor and compound semiconductor
- LED: Light emitting diodes
- MEMS: Micro-electro-mechanical systems
- Data storage
- Medical devices
And more: Contact us with your requirements
Find out more about how the P-170 can improve the efficiency of your semiconductor production by talking to our experienced technical experts today. The surface metrology specialists at CN tech would be happy to discuss your production application and help you find the right solution. Contact us today!