DST3-T, is equipped with a 7” colored touch screen and semi-automatic control and data input that can be operated by even inexperienced users. The vacuum and deposition information can be observed as digital data or curves on the touch screen. Information of the last 300 coating can also be saved in the history page.
DST3-TA - Sputter + Thermal Evaporation – Angled Cathodes
The DST3-T Triple Target Turbomolecular Pumped Sputter Coater is a multi vacuum coater system combines thermal evaporator and sputter coater in one single compact desktop system. The high vacuum system is suitable for deposition of a wide range of materials. Triple magnetron target desk sputter coater can easily switch between Evaporation and Sputtering condition (Not Simultaneously).
Vac Coat Limited is a designer and manufacturer of high-quality tailor-made Physical Vapour Deposition (PVD) and Vacuum Coating Systems with excellent customer care and after sale services. Equipped with more than 25 years’ experience in the vacuum and Thin Film deposition technologies. Their research and development team supported by academic scientists and qualified engineers are highly active to develop new designs and meet special inquiries received from clients. Designed and manufactured components by Vac Coat's engineering team meets high-quality standards. Their vacuum coating systems have been sold to many universities and research centers through distributors worldwide with very good references and feedback.
- Sputtering and Thermal Evaporation process in a compact system
- High vacuum level
- Equipped with DC and RF power supplies suitable for metals, semiconductors and dielectrics
- Three 2” water-cooled angled, magnetron cathodes suitable for producing alloy films (DST3-TA) and multilayer deposition
- One thermal source installation
- Two fixed and movable quartz crystal monitoring system for real time thickness measurement (1 nm precision)
- Two MFCs
- Manual or automatic Timed or Thickness deposition
- Intuitive touch screen to control coating process and rapid data input
- User friendly software that can be updated via network
- Equipped with three manual shutter
- Tillable and change height of rotary sample holder with ability to selection of the cathodes
- 500 °C substrate heater (optional)
- 300 V DC substrate bias voltages (optional)
- Unlimited deposition time without breaking vacuum
- Two-year warranty
DST3 – TA (Angled Cathodes)
The DST3-TA is equipped with three angled cathodes with a common focal point. It can sputter from two or three (optional) targets simultaneously or independently to form alloys or multilayer deposition respectively. The maximum size of substrates in this model could be 3 inches.
Splutter Coater & Thermal Evaporator
The DST3-T Magnetron Desk Sputter Coater is equipped with a large chamber (300 mm diameter) and three 2” diameter water-cooled cathodes which make it suitable for long time deposition. The magnetron desk sputter coater is equipped with RF and DC power supplies. It can sputter semiconductors dielectrics and metal (oxidizing & noble) targets.The system is equipped with an auto adjustable matching box minimizing the reflected power in the RF sputtering process. For increasing film adhesion to the substrate and to improve the film structures a 300 V DC bias voltage can be applied to the substrate (optional).
The DST3-T is equipped with a high current power supply and low-voltage (resistive) thermal evaporation platform suitable for a wide variety of thermal evaporation applications. The system allows controlled thermal evaporation of wide range materials onto substrate. Different types of thermal evaporation sources (Boat, Basket, and Coil) can be installed on the single thermal source holder.
Touch Screen Control with Colorful Display
The holder is made according to the conventional size of microscope slides, but the user can order customize size according to his/her needs. On the sample holder number of clamps is created to hold the small samples with a simple method during the rotation.
The vacuum chamber is Cylindrical Pyrex with 300 mm OD and 200 mm H. The DST3-T is fitted with an internally mounted 90 l/s Turbomolecular Pump, backed by a 1.4 m3/h diaphragm or 4 m3/h two stage Rotary Vane Pump.
DST3-T is equipped to plasma cleaner option. Plasma cleaning is the process of removing organic matter from the surface of substrate through the use of an ionized gas called plasma. Pre-Cleaning the substrate prior to the deposition of film to eliminate contamination (C-based, Oxides) from substrate surface improve the adhesion between the substrate and the subsequent layers.
DTT - Desk Thermal Evaporator
DST3-S - Sputter Only – Straight Cathodes
DST3-TA - Sputter + Thermal Evaporation – Angled Cathodes
DST3-TS - Sputter + Thermal Evaporation – Straight Cathodes
DST2-A - Lower Priced 2 head Sputter Only System
- Metal, Semiconductor and Dielectric Films
- Nano & Microelectronic
- Solar Cell applications
- Co-Sputtering processes
- Glad Sputtering
- Optical components coating
- Thin film sensors
- Magnetic thin film devices
- Fine grain structural deposition for SEM & FE-SEM sample preparation
|Pump||High Vacuum Turbomolecular Pump|
|Pumping Speed||90 l/s 350 l/s|
|Ultimate Pressure||7×10-6 Torr 7×10-7 Torr|
|Rotary Vane Pump||Two stage rotary vane pump 4 m3/h|
|Control||Independent sputtering control rate for each cathode to produce fine grain structures|
|Power Control||Automatic control of deposition power independent of pressure|
|Temperature Control||Automatic control of the cathode’s temperatures to protect the life time of the magnets|
|Water-cooled||Water-cooled high current electric feedthrough|
|Mass Flow Controller||Two precision Mass Flow Controller (MFC) for fine control of Ar flow and so reactive sputtering gas|
|Graphs||Records and plots of coating parameters graphs|
|Transfer||Transfers curves and deposition process data by a USB port to PC|
|Voltage (optional)||300V DC bias voltage (optional)|
|Plasma Cleaner (optional)||Equipped to plasma cleaner (optional)|
|Substrate Heater (optional)||Equipped to 500˚C substrate heater (optional)|
|DC Power Supply||0-1200V, 0-500 mA|
|High Current Power Supply||0-24 V, 0-100 A|
|RF Power Supply||300 W RF power supply with automatic matching box|
|Utilities||220V-240V, 50/60HZ, 16A|
|Box Dimensions||50 cm H x 60 cm W x 47 cm D|
|Shipping Weight||160 kg (Pump, Rack and Box)|
If you would like to learn more about the DST3-TA - Sputter + Thermal Evaporation – Angled Cathodes, contact our experienced technical team today. We would be happy to help you find the right profilometry solution for your needs. Contact us today!