CP-8000+

The CP-8000+ is an advanced sample preparation tool that etches a cross section of a sample using an argon ion beam. This process avoids physical deformation and structural damage, without requiring complicated chemical processes. In addition, the system simplifies cross-sectional analysis of the sample by processing large areas from tens of um to several mm.

Manufacturer

COXEM

COXEM manufactures and provides Scanning Electron Microscope (SEM), the most widely used platform technology in Nano- Metrology of Nano-scale. As a partner of Nano-fusion technology that changes industrial condition in 21 century, COXEM tries to provide the best quality service. SEM is the precision instrument, can be used for analysing the shapes or constituents of microstructure materials in quantitative and qualitative. SEM is an essential instrument for development of basic science and an indispensable infra for technical innovation, used in chemistry, biology, material science as well as nano-materials and nano-biology.

CN Tech are the exclusive Coxem distributor for:

United Kingdom and Republic of Ireland.

Product Videos

CP-8000+ Operation

Introduction to the CP-8000+

Key Features

  • A high etching rate of 700 μm per hour (based on Si, 8 kV)
  • Ability to save/load recipes that are frequently used
  • Step by step recipes with automatic execution function
  • Easy to load sample using smart sample holder
  • Real-time observation of ion beam status and etching status through chamber camera
  • Convenient operation - intuitive GUI and easy touch screen
  • Minimises thermal damage with the ion beam Auto On/Off function
  • Fast and convenient sample alignment with ion beam using built-in digital microscope
  • Provided with noise, vibration, oil-free diaphragm pump
  • Flat milling function provided for plane etching of a large areas

Principles of Cross Section Polisher

When a voltage is applied to the ion gun and argon gas is injected, plasma is generated and an ion beam is directed at the sample by an acceleration voltage to begin the etching process. If the sample is located behind a metal mask and the ion beam is directed at the metal mask and sample, the shielding effect of the metal mask minimises beam damage to obtain clean cross-sectional etching results.

Mechanical Polishing vs CP Polishing

If you polish using a mechanical polishing device, it is difficult to check the exact state of the cross section due to physical damage and contamination. However, when performing cross-section processing with CP using an ion beam, you can observe the micro-surface structure of the sample without structural damage and contamination.

FIB Polishing vs CP Polishing

When etching a single side of the same sample with the CP-8000+, you can achieve excellent time and cost savings by etching a much wider cross section in a shorter time, compared to focused ion beam (FIB). The images are the results of the same specimen milled in two different ways, FIB and CP for the same period of time.

Intuitive GUI

Digital Microscope

Using a digital microscope, the position of the ion beam and the position of the sample can be easily aligned through the screen.

Chamber Camera

You can check the status of the ion beam through the camera inside the chamber and check the degree of cross-sectional etching in real time.

Auto Beam On / Off Mode

A feature designed to minimise heat damage caused by the ion beam by turning the beam on and off according to the set Ion Beam On/Off timer. It is useful for obtaining accurate cross-sectional conditions when etching heat-sensitive samples such as polymers and paper.

Recipe Mode

Frequently used etching conditions can be stored in the recipe list to easily apply setting values whenever necessary. In addition, a step-by-step mode is also available to store several recipes and automatically execute them to etch samples.

Flat Milling

The CP-8000+ can process samples in a plane using a dedicated holder. When a sample is mounted in the dedicated holder and the flat milling function is used, several mm2 areas are etched by the ion beam based on the rotation centre axis. At this point, since the polishing speed, area, and depth vary depending on the angle of incidence at which the ion beam hits the sample surface, uniform surface polishing should be induced by rotating and adjusting the angle of the sample. As the ion beam irradiates a larger area to etch an oxide layer or foreign substance, it is useful for pre-treatment of a large area of the sample.

Crystallography Of Metallic Material

Precise surface pre-treatment is a very important factor for accurate grain and grain boundary analysis of metal samples. Ion beam milling is an ideal method to prepare samples prior to studying the mechanical and electrical properties of the sample through EBSD analysis.

EPMA Analysis Of Cross-Section Of Mineral

After removing the oxide layer and foreign substances in the sample cross section through ion milling, EPMA component analysis for more accurate qualitative and quantitative analysis is possible. The following is a mineral sample, which was etched with CP to remove foreign substances and oxide layers on the surface before analysing the elemental distribution through EPMA analysis.

EDS

By etching a sample with an ion beam to minimise damage to the cross-sectional structure and analysing the components with EDS, the exact distribution of surface components can be observed without structural distortion of the sample.

Specifications

Gas Used Ar (Argon) gas
Milling Speed 700 μm/h (Si at 8kV)
Accelerating voltage 2 to 8kV
Beam Diameter Approx. 500 μm
Working Pressure 4.3 x 10-5 torr
Beam Alignment Precision beam alignment
using Digital Microscope
Maximum sample size 20(W) x 10(D) x 9(H)mm
Sample Moving Range (Z: ±2mm, Y: ±2mm)
Rotation -35° ~ +35°
Stage for flat milling Tilt Range : 40° to 80°
Rotation Speed : 6 rpm/min
Sample Size : Ø30 x 11.4mm
Display Touch panel (1024 x 600 7 inch display)
Chamber Camera Magnification : 5x, 10x, 20x, 40x
4 step brightness control
Ion beam observation mode
Digital Camera for sample alignment Magnification : 5x, 10x, 20x, 40x
USB type
Evacuation System Turbo-molecular pump (66L/s)
+ Diaphragm pump
Dimension 610(W) x 472(D) x 415(H)mm

Applications

Semi-Conductor

Powder

Solar Cell

Battery

Fibre

Minerals

Alloys

Films

Downloads

Product Videos

CP-8000+ Operation

Introduction to the CP-8000+

Brochures

CP-8000+ Brochure

View Brochure

Service Support

Comprehensive repairs and servicing

Annual Support Programs

Your metrology instrumentation is a major investment that is critical to your business operation and success. In today’s competitive climate, it is more important than ever to extend the functionality and peak performance of your metrology equipment years beyond the expiration of your factory warranty. CN Tech’s Support Programs will help ensure that your investment is protected, and that you and your instrument’s are always operating at peak performance.

With over 20 years’ experience servicing and repairing you can be assured that your system is in safe hands. The independent services we offer include system relocation, maintenance visits, parts and consumables, and break down interventions.

CN Tech’s Support Programs are an economical way to guarantee optimal working condition:

  • Annual Preventive Maintenance
  • Priority Technical Assistance
  • Preferred Parts Availability
  • On-Site User Training
  • Remote Diagnostics
  • No surprise repair expense and much more!

Support Contact Example

An example of our service and support contracts are shown below:

Brochures

Metrology & Instrumentation Annual Support Programs 2022/23

CN Tech's Support Programs will help ensure that your investment is protected, and that you and your instrument’s are always operating at peak performance.

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