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Evactron® E50 Plasma De-Contaminators

Product Features

Key Features

  • High Power Cleaning
  • Compact Size Plasma Source
  • Energy Efficient Plasma Generation
  • "Pop" Ignition
  • Touch Screen Interface
  • Vacuum Safety Interlock
Evactron® E50 system, with plasma source, controller, and touch screen tablet interface

E50 Plasma Cleaning Systems

The Evactron® E50 series of plasma de-contaminators provides high performance and high power plasma cleaning in a compact and easy to use form factor. Suitable for use with SEM, TEM, and FIB instruments, the E50 plasma cleaners provide high power cleaning to ensure maximum performance. The E50 technology uses an external hollow cathode RF (XHCRF) plasma radical source for high power and efficient operation.

The E50 plasma cleaners are very easy to set up and operate, and feature a touch screen tablet interface, with a simple “one button” cleaning control. Advanced parameters such as power, cleaning time, and cycle counts can also be adjusted, and saved as user-programmable recipes. The compact design of the E50 plasma sources makes them ideal for attaching to crowded SEM and FIB chambers.

Evactron® E50 system, with plasma source, controller, and touch screen tablet interface

Sample Cleaning

Contamination from hydrocarbon build-up inside instruments and on samples can compromise high resolution image quality and sensor sensitivity. The plasma de-contamination technology used by Evactron’s E50 plasma cleaners provides a fast, effective, and gentle method of removing contamination. This ensures that high-quality, artefact-free imaging and efficient analytical measurement is possible. The E50 plasma-decontaminators do not damage samples, and cause no sputter etch.

A SEM image of a sample with considerable hydrocarbon contamination
Sample with contamination
A SEM image of the same sample after cleaning with an Evactron® system, which has removed the majority of the contamination
Sample cleaned with Evactron®

Specifications

  • 75W peak RF power, and 50W continuous
  • Plasma and UV afterglow dual action cleaning
  • Energy efficient hollow cathode, capacitive coupled plasma (CCP)
  • "Pop" ignition at high vacuum
  • User-programmable recipes to control power, cleaning time, and number of cycles
  • Touch screen tablet controls with Bluetooth communication
  • Wide range pressure operation from 0.3 Pa/ 2 mTorr to 80 Pa/ 600 mTorr
  • Optional external interlock connection
  • TMP compatible, no advance venting needed
  • 100X+ faster than previous Evactron models
  • Not damaging to fragile components with no sputter etch
  • PRS can be installed on the SEM chamber or the load lock
  • "One button" cleaning operation
  • No match or gas flow adjustments needed for plasma ignition
  • TUV, NRTL and CE compliance testing pending