- Thin and transparent substrates - new detection optics design does not degrade signal as the substrate becomes thinner
- Multiple channel detection provides the necessary signals to separate pits from particles down to submicron in size
- New light collector design capable of detecting defects on rough surfaces or films
The ZetaScan series are fully automated 300mm capable defect inspection tools that can address a variety of substrates such as opaque and transparent wafers as well as touch panels, rough ground, polished or unpolished substrates. Based on Zeta's revolutionary multi-mode approach to inspection, the ZetaScan series defect inspectors provide high defect sensitivity at high throughput.
- ZSP - Zeta Specular measures reflectivity.
- ZTP - Zeta Topography measures surface topography.
- ZTS - Zeta Top Scatter measures scattering signal above the sample.
- ZSS - Zeta Side Scatter measures scattering signal to the side of the sample
Scanning Beam Optics
- Scanning Beam Optics combines the strong signal from a small spot beam (higher intensity than a line focus beam) with the speed of the scanning laser.
- ZetaScan allows for any sample shape up to 370mm X 470mm, very thin samples, and other delicate samples, such as thin glass or bonded wafers.
- 405nm laser diode with the latest technology in beam shaping optics.
Automated Defect Classification
The multiple-mode optics can be used for easy defect classification. In the glass wafer inspection example shown on the right, surface particles and interface particles can be separately classified based on the differences in the ZTP, ZSP and the ZSS images. ZetaScan's innovative optical design also allows the user to simultaneously detect and accurately classify the bottom surface particles based on their optical signature. This unique capability is unmatched in the defect inspection industry.
Fast Full Wafer Defect Mapping
The linear scanning motion of the incident beam is combined with the lateral motion of the wafer to quickly generate the full wafer defect map. This type of scan is faster, more stable and less sensitive to vibration as compared to other 'helical' or 'spiral' scan based tools.
- 0.08µm PSL on polished Si
- 0.13µm - 20µm
- 0.1µm deep, >3µm in diameter/length
- Stains, Micro-waviness, Epi defects
- Separate Pit/Particle
Full wafer1 scan
- <120sec for a 300mm substrate
- Can handle rough polish ~5µm RMS
- Class 100
- ±5% (1σ/Average)
1Full wafer inspection at best sensitivity. Throughput is higher at lower sensitivity
2Static repeatability and accuracy based on measuring a polished Si wafer deposited with NIST traceable PSL particles
- 405nm (violet) Laser Diode
- High resolution PMT detectors
- Side Scatter
- Top Scatter
- Linear scan
- 50mm - 300mm diameter
- 300mm x 300mm XY travel
- Up to 25mm
- Recipe & Data Upload/Download