ZETASCAN Series

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Short Description
  • The ZetaScan series are fully automated 300mm capable defect inspection tools that can address a variety of substrates such as opaque and transparent wafers as well as touch panels, rough ground, polished or unpolished substrates.

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Product Overview
  • Key Features

    • Thin and transparent substrates - new detection optics design does not degrade signal as the substrate becomes thinner
    • Multiple channel detection provides the necessary signals to separate pits from particles down to submicron in size
    • New light collector design capable of detecting defects on rough surfaces or films

    Product Description

    The ZetaScan series are fully automated 300mm capable defect inspection tools that can address a variety of substrates such as opaque and transparent wafers as well as touch panels, rough ground, polished or unpolished substrates. Based on Zeta's revolutionary multi-mode approach to inspection, the ZetaScan series defect inspectors provide high defect sensitivity at high throughput.

    Multi-Mode Optics

    • ZSP - Zeta Specular measures reflectivity.
    • ZTP - Zeta Topography measures surface topography.
    • ZTS - Zeta Top Scatter measures scattering signal above the sample.
    • ZSS - Zeta Side Scatter measures scattering signal to the side of the sample

    Scanning Beam Optics

    • Scanning Beam Optics combines the strong signal from a small spot beam (higher intensity than a line focus beam) with the speed of the scanning laser.
    • ZetaScan allows for any sample shape up to 370mm X 470mm, very thin samples, and other delicate samples, such as thin glass or bonded wafers.
    • 405nm laser diode with the latest technology in beam shaping optics.

    Automated Defect Classification

    The multiple-mode optics can be used for easy defect classification. In the glass wafer inspection example shown on the right, surface particles and interface particles can be separately classified based on the differences in the ZTP, ZSP and the ZSS images. ZetaScan's innovative optical design also allows the user to simultaneously detect and accurately classify the bottom surface particles based on their optical signature. This unique capability is unmatched in the defect inspection industry.

    Fast Full Wafer Defect Mapping

    The linear scanning motion of the incident beam is combined with the lateral motion of the wafer to quickly generate the full wafer defect map. This type of scan is faster, more stable and less sensitive to vibration as compared to other 'helical' or 'spiral' scan based tools.

Specification
  • Performance Specifications

    Particle

    • 0.08µm PSL on polished Si

    Dynamic range

    • 0.13µm - 20µm

    Pit, Scratch

    • 0.1µm deep, >3µm in diameter/length

    Other defects

    • Stains, Micro-waviness, Epi defects

    Classification

    • Separate Pit/Particle

    Full wafer1 scan

    • <120sec for a 300mm substrate

    Rough Substrate

    • Can handle rough polish ~5µm RMS

    Cleanliness

    • Class 100

    Repeatability2

    • ±5% (1σ/Average)

    1Full wafer inspection at best sensitivity. Throughput is higher at lower sensitivity

    2Static repeatability and accuracy based on measuring a polished Si wafer deposited with NIST traceable PSL particles

    System Features

    Illumination

    • 405nm (violet) Laser Diode

    Detectors

    • High resolution PMT detectors

    Detection Channels

    • Side Scatter
    • Top Scatter
    • Topography
    • Specular

    Scan Type

    • Linear scan

    Substrate Size

    • 50mm - 300mm diameter

    Motorized Stage

    • 300mm x 300mm XY travel

    Sample Thickness

    • Up to 25mm

    Sample Type

    • Polished/Unpolished
    • Opaque/Transparent

    Vibration Isolation

    • Built-in

    Factory Automation

    • Recipe & Data Upload/Download
Product Brochure

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