The Zeta3D software has a simple and intuitive user interface for data acquisition and analysis. A short learning curve for engineers and operators leads to better productivity.
Versatile & Fast
The high resolution 3D optical profiler takes as little as 15sec per measurement. Bump height, roughness, film thickness (or reflectivity) and wafer bow can be measured without the need for unloading the wafer and moving it to a new tool
The Zeta-500 meets Class 100 standards and is equipped with a built-in vibration isolation system. The comprehensive Zeta 3D software with auto-data upload completes the fab ready package.
The Zeta-500 profiler is a semi-automated 300mm capable metrology tool that can address a variety of applications such as bump height, roughness, etch depth, film thickness as well as wafer bow. Based on Zeta's revolutionary multi-mode approach to measurements, the Zeta-500 profiler packs the power of several tools into one compact platform.
Multi-Mode Optics for any type of measurement
The Zeta-500 is available with several advanced imaging techniques:
- ZDot TM innovative 3D imaging is standard on all our optical profilers. ZDot™ technology enables True Color 3D Imaging and a 10nm Z resolution.
- ZFT Visible range integrated Spectroscopic Reflectometer for thin film thickness and seed layer metal reflectivity measurements.
- ZX5 Vertical Scanning Interferometry is ideal for measuring a large field of view (up to 4.7mm x 3.5mm) on planar surfaces.
Shorter Process Feedback Cycle
Multi-Mode Optics means shorter lead time for process feedback, saving valuable time. Having multiple measurement capabilities within one system eliminates wafer transfer steps between several metrology and review tools. In one process step, the Zeta-500 profiler can perform height, dimensions, roughness, bow, stress, reflectivity and thickness measurements.
The high resolution 3D images and analysis from the Zeta-500 profiler also provide the answers for most defects and process excursions. This reduces the number of wafers or sites that need to be reviewed by the time-consuming and expensive AFM or SEM analysis. The Zeta-500 is capable of measuring from nanometers all the way up to millimeters.
Full Wafer Mapping
The automated wafer deskew and pattern matching capability in the Zeta3D software can be used to set up a multi-site sequence map. Typical 5-pt, 9-pt, 49-pt or customized site maps can be easily created and executed. Data is stored in text or csv format, making it easy to export.
Wafer Bow & Film Stress
Semiconductor fabs have typically relied on a line scan approach to measure 2D bow of wafers via either laser based scans or stylus profilers. Now, with the Zeta-500 profiler, the process engineer can easily measure an array of locations across the wafer to obtain the complete 3D wafer warp profile. Pre and Post film deposition measurements are used to calculate the Film Stress.
Performance Specifications (Zeta-500)
- ~10-30 sec/site (ZDot™)
- ~2 seconds per site (ZFT)
Full Wafer Film
- ~49 sites mapping in < 2.5 minutes
XY Pixel Resolution
- ~0.1µm typical
- 10 nm with standard ZDot™
- ~1 nm with (optional) ZX5
- 20 nm (1σ)
Film Thickness Range
- 30nm to 100µm (ZFT)
- 5µm to 500µm (ZDot™)
Film Thickness Repeatability2
- 0.1% (1σ)
1Static repeatability and accuracy based a 15-time repeat measurement on a nominal 8.0µm VLSI step-height standard, 100x/0.9NA objective, and piezo stage
2 Static repeatability and accuracy based on a 15-time repeatmeasurement of a nominal 2730Å oxide film on silicon
- 1024x768, 1280x960, 1920x1440
- 35,000x combined optical & digital
- Two (2) Ultra-Bright White LEDs
- 320mm x 320mm XY travel
- 300mm and 200mm
- Zeta 500 System 1190 X 1160 X 1667 mm (width x depth x height)
- Weight 318kg (500lb)
- 100 - 230 VAC
- 18-30° C, non-condensing, ±1° C per hour